<b>Small Outline Package</b> >NAME >VALUE <b>Dual In Line Package</b> >NAME >VALUE <b>HP-VFQFP-N20</b> Micro Lead Frame package (MLF) >NAME >VALUE <b>RESISTOR</b> >NAME >VALUE <b>RESISTOR</b><p> wave soldering >NAME >VALUE >NAME >VALUE 1 >NAME >VALUE <b>PIN HEADER</b> >NAME >VALUE 1 <b>CAPACITOR</b> >NAME >VALUE >NAME >VALUE 1 >NAME >VALUE <b>SOT 23</b> >NAME >VALUE <b>Power TOPLED®</b><p> Source: http://www.osram.convergy.de/ ... LA_LO_LA_LY E67B.pdf >NAME >VALUE R G B A <b>Small Outline Package</b> <b>Dual In Line Package</b> <b>HP-VFQFP-N20</b> Micro Lead Frame package (MLF) <b>RESISTOR</b> <b>RESISTOR</b><p> wave soldering <b>PIN HEADER</b> <b>CAPACITOR</b> <b>SOT 23</b> <b>Power TOPLED®</b><p> Source: http://www.osram.convergy.de/ ... LA_LO_LA_LY E67B.pdf >NAME >VALUE >VALUE >NAME >NAME >VALUE >NAME >VALUE MISO SCK RST VCC MOSI GND non-polarized capacitor >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE <b>Resistor (US Symbol)</b> <p> Variants with postfix FAB are widened to allow the routing of internal traces Since Version 8.2, EAGLE supports online libraries. The ids of those online libraries will not be understood (or retained) with this version. Since Version 8.3, EAGLE supports URNs for individual library assets (packages, symbols, and devices). The URNs of those assets will not be understood (or retained) with this version. Since Version 8.3, EAGLE supports the association of 3D packages with devices in libraries, schematics, and board files. Those 3D packages will not be understood (or retained) with this version.