Carvera making PCB¶


Carvera Desktop CNC Machine

Team¶

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Sedat Yalcin (Fab Lab Hisar Idealab, Istanbul, Turkey)
Mark Blanc (ESAN, Lima, Peru)
Nicole Stancampiano (PAST Innovation Fab Lab, Columbus, United States)
Kelleigh Huey (PAST Innovation Fab Lab, Columbus, United States)
Yuichi Tamiya (FabLab Kannai, Yokohama, Japan)

PCB design¶

Ref. Instructor bootcamp 2024 Leon

Trace and Interior	Foot Print

	PNG image size 45.47x 47.28mm, 800dpi Download Fusion360 Electronics file

Preparation¶

Tool setting¶

Tool 3: 0.8mm Corn Bit (1/32")
Tool 4: Single Flute Bit 30_Deg (1/64")
Tool 5: UV solder mask removal tool

Process¶

Ref. Carvera PCB tutorial

Process-1: Generate Toolpath(trace and interior)¶

Mods CE

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↑Click above image to enlarge "mill dual-tool 2D module" settings

Process-2: Cavera Controller¶


Connect USB	Go to Upload File
Serect .nc file	Click Select
path is appeared	Set Work Origin and Run

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Note

Interior max cut depth is 0.6 mm. If milled too deep, the UV-ink remains uncured in deep milled gap

Process-3: Deburring¶

Use sanding tool/paper

Process-4: Apply UV Curing Solder Mask Ink and Cure¶

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Process-5: Toolpath(Foot Print)¶

Note

Invert Foot Print image
Tool 5: UV solder mask removal tool

↑Click above image to enlarge "mill dual-tool 2D module" settings

Process-6: Cavera Controller¶

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Note

Scan Margin -> uncheck
Auto Leveling -> uncheck

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Process-7: Apply UV Curing Solder Mask "White" Ink¶

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Process-8: tool path¶

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Note

offset number: 1

Process-9: laser engrave¶

Scale(Laser Power):10%
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Process-10: Wipe¶

Note

don't use alcohol or it may remove some of the green layer

Process-11: Mill Interior¶

Mods -> Interior -> max cut depth: 1.7mm
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Final Result¶

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Soldered PCB¶

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